The ModuS-U6 high-voltage process offers a wide variety of mixed-signal circuits. Using the unique PREMA fabrication process, the following components can completely be implanted:
Without limitations, these electrical components can be integrated and combined into ASICs fabricated by PREMA Semiconductor GmbH. With minimum resolutions of 800 nm, after the development of prototypes, series production can be performed with 150 mm (6'') and 200 mm (8'') wafers.
The integration of electric components into ASICs enable sophisticated analog and mixed-signal circuits with unique properties: