On a wafer, all ICs are tested first by our quality department. The IC test bases on a procedure that is set by PREMA and your experts. ICs that drop out are marked to be separated later on. Occasionally, voltage references or other circuit blocks can be trimmed at the same time.
Afterwards, tested wafers are sawn, bonded and encapsulated. All common PDIP, SOP and SSOP packages are available. Other package types can also be offered upon request (g.e. Flip Chip). To complete the production cycle, all encapsulated parts must pass another complete IC inspection, before the final shipment to you is initiated. Additional test procedures, such as burn-in, are available on demand. Encapsulated Chips (ICs) can be delivered in tubes or with tape on reel.
Tested wafers can also be delivered as produced, grinded, sawn on tape, sawn on tape with expander ring or in waffle pack.