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Wafer-Level-Integration

Wafer-Level-Integration

As an innovative company with research engineers in different fields from process development to device engineering, PREMA is open for cooperative projects with partner companies.

Examples of such cooperations could be

  • joint development and production of systems with MEMS or other sensors and ASICs (also monolithically)

  • innovative packaging solutions using glass substrates

  • 3D packaging, combining a PREMA ASIC with other components

  • chemical/biological films applied in FET structures as sensing devices

Your knowledge and technology combined with our semiconductor process and production know-how can lead to new products.

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